Germany – Miscellaneous special-purpose machinery – Die-to-Wafer Bonder (IPMS-MRS14.1) - PR922727-2480-P

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Deutschland – Diverse Maschinen und Geräte für besondere Zwecke – Die-to-Wafer Bonder (IPMS-MRS14.1) - PR922727-2480-P

🇩🇪 GermanyContracting authority: Fraunhofer-Gesellschaft - Einkauf B12

Estimated value

Not disclosed

Deadline

Jul 24, 2026

Published

Jun 25, 2026

Procedure

Open

Die-to-Wafer Bonder (IPMS-MRS14.1)

Description shown in the original language of the notice.

CPV classification

42990000 — Miscellaneous special-purpose machinery

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